Semiconductor

We enhance customers’ testing process by providing more time and cost efficiency.

World's thinnest "0.05mm" Sheet Contact
Union High Speed Sheet "UHSS"

"UHSS" is...
An up-to-date contact, completely changed the concept of conventional semiconductor testing enabling to use for wafer/package/system level in all phases from prototype through mass-production,

・High current
Current tolerance of 3A per dot, unachievable with conventional sheet-type contacts * Figure determined through testing by UPT

・RF testing
200 Gbps high-frequency support through ultra-short transmission paths with thicknesses as low as 0.05 mm * Figure determined through testing by UPT

・Fine pitch / Minimal contact point
Pitch: 0.08mm~, Contact point(=dot): 0.06mm~

・High durability
Durability of 50,000 uses and above, capable of withstanding mass production process use * Figure determined through testing by UPT

Union Contact ™
Semiconductor test solutions

As semiconductor are becoming more layered, testing process are getting more complex. We enhance customers' testing processes by providing more time and more cost efficiency.

Union Contact ™ <br />
Semiconductor test solutions

Union Alloy ™
Original alloy with superior performance

We developed our original alloy which has the same conductivity level as copper and holds better
strength.

Union Alloy ™<br />
Original alloy with superior performance

Union Socket Ninja™
For Device Testing

To apply Union Contact™ to your testing device, we developed Union Socket Ninja™.
Please ask our sales representatives for the semi-custom type test sockets.

Union Socket Ninja™<br />
For Device Testing