We enhance customers’ testing process by providing more time and cost efficiency.
World's thinnest "0.05mm" Sheet Contact
Union High Speed Sheet "UHSS"
An up-to-date contact, completely changed the concept of conventional semiconductor testing enabling to use for wafer/package/system level in all phases from prototype through mass-production,
Current tolerance of 3A per dot, unachievable with conventional sheet-type contacts * Figure determined through testing by UPT
200 Gbps high-frequency support through ultra-short transmission paths with thicknesses as low as 0.05 mm * Figure determined through testing by UPT
・Fine pitch / Minimal contact point
Pitch: 0.08mm~, Contact point(=dot): 0.06mm~
Durability of 50,000 uses and above, capable of withstanding mass production process use * Figure determined through testing by UPT
Union Contact ™
Semiconductor test solutions
As semiconductor are becoming more layered, testing process are getting more complex. We enhance customers' testing processes by providing more time and more cost efficiency.
Union Alloy ™
Original alloy with superior performance
We developed our original alloy which has the same conductivity level as copper and holds better
Union Socket Ninja™
For Device Testing
To apply Union Contact™ to your testing device, we developed Union Socket Ninja™.
Please ask our sales representatives for the semi-custom type test sockets.